METAL TREATMENTS 化学配方数据库

配方类型：	METAL TREATMENTS
配方说明：	Copper Plating
配方组成：	Sodium Carbonate/30 g/l Formula No. Current Density/5.0 A/dm^2 Potassium Hydroxide/4.0 g Copper/15 g/l Copper Fluoborate/56 g/l "Versene"-T/20 g/l Fluoboric Acid/340 g/l Boric Acid Temperature/ambient Current Density/5.0 A/dm^2 Copper/24 g/l B: Formaldehyde/37% by weight Pyrophosphate/185 g/l P2O7 ^-4/Cu/7.6:1 Ammonia/1.0 g/l Nitrate/7.0 g/l pH:/8.2 Orthophosphate/< 60 g/l Addition agent/0.7 m/l Temperature/52 C Current density/4.5 Silver Nitrate/0.2 g Copper Sulfate (pentahydrate)/5 g/l Sodium Hydroxide/7 g/l Distilled Water/100.0 cc formaldehyde (37% w/v)/10 ml/l Rochelle Salt/25 g/l Copper/48 g/l Rochelle Salt/4.0 g Copper Sulfate (CuSO4.5H2O)/188 g/l Sulfuric Acid/75 g/l Chloride Ion/- Temperature/ambient Current Density/5.0 A/dm^2 A: Rochelle Salt/170 g/l Copper Sulfate (anhydrous)/2.0 g Copper/15 g/l Copper Sulfate
配制方法：	Formula No.9 $d: Copper Cyanide/26 g/l Sodium Cyanide/35 g/l Sodium Carbonate/30 g/l Rochelle Salt/45 g/l Copper/19 g/l Free Sodium Cyanide/6.0 g/ pH:/12.6 Temperature/65 C Current density/4.0 A/dm^2