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| 配方类型： |
METALS AND THEIR TREATMENT |
| 配方说明： |
Improved Copper Plating |
| 配制方法： |
The poor adhesion of copper deposited on steel by chemical replacement using a copper salt in acid solution can be overcome by using Ethoquad C/12 in the salt formulation. In the electroplating of copper the brightness can be increased by adding small quantities of Ethoquad C/25 or Ethoquad 18/25 to the plating. |
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