| 配方类型： |
METALS AND THEIR TREATMENT |
| 配方说明： |
Cleaning Solder Surfaces |
| 配方组成： |
A dip, commonly employed to clean up solder surfaces and to remove
the sulfate film left by etching consists of the following
Thiourea/13 oz/gal
48% fluoboric acid/13 fl oz/gal |
| 配制方法： |
This requires about 1-3 minutes at 110-130'F, and a nonionic wetting agent can be added for smoother action. |
|
