中文名称:3,3',5,5'-四甲基联苯双酚二缩水甘油醚
- 3,3',5,5'-四甲基联苯二酚二缩水甘油醚
- 4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl
- Tetramethylbiphenyl diglycidyl ether; 4,4'-Bis(glycidyloxy)-3,3',5,5'-tetramethylbiphenyl; 3,3',5,5'-Tetramethyl-4,4'-diphenol diglycidyl ether; 2,2'-{[3,3',5,5'-Tetramethyl(1,1'-biphenyl)-4,4'-diyl]bis(oxymethylene)}bisoxirane; 2,2'-[(3,3',5,5'-tetramethylbiphenyl-4,4'-diyl)bis(oxymethanediyl)]dioxirane; GS4000,TMDE; 4,4'-diglycidyloxy-3,3',5,5'-tetramethyl biphenyl
- 85954-11-6
- 413-900-7
- C22H26O4
- 354.4394
- InChI=1/C22H26O4/c1-13-5-17(6-14(2)21(13)25-11-19-9-23-19)18-7-15(3)22(16(4)8-18)26-12-20-10-24-20/h5-8,19-20H,9-12H2,1-4H3
- 1.149g/cm3
- 105℃
- 473.525°C at 760 mmHg
- 131.775°C
- 0mmHg at 25°C
- 外观 类白色粉末
熔点 104.0-110.0℃
含量 ≥98.5%( LC)
挥发分 ≤0.2%
灰分 ≤0.3%
环氧值 ≥0.52
总氯 ≤300ppm
- 含有联苯结构二缩水甘油醚型环氧树脂,,具有良好的色泽和透明度,较普通环氧树脂有优异的耐热性和力学性能,环氧值高、总氯含量低等理化性质和性价比,已被广泛用作多种型材、涂料、胶黏剂、复合材料树脂基体,特别是在电子封装材料中具有理想的电决缘性能而备受青睐,是一种新型环氧树脂
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