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| 配方类型： |
METALS AND THEIR TREATMENT |
| 配方说明： |
Copper Plating Baths for Printed Circuits |
| 配方组成： |
Sodium cyanide/4.6 oz/gal
FORMULA No.4
Sulfate Copper
Current density/25 amp/ft^2
Cost/gal/$2.00
cost/gal/$0.55
pH/12.5 oz/gal
Pyrophosphate Copper:
Proprietary salts/45 oz/gal
Ammonia/0.7 fl. oz/gal
"Temperature"/130-140'F
Agitation/Air
Sodium carbonate/4.0 oz/gal
Current density/40 amp/ft^2
Cost/gal/$1.70
Temperature/140'F
Copper cyanide/3.5 oz/gal
copper sulfate/30 oz/gal
Sulfuric acid/8 oz/gal
Brightener/70-75'F
Fluoboric acid/45.5 oz/gal
Temperature/Air
Agitation/40 amp/ft^2
Current/$0.50
Cost/gal
copper fluoborate/7.5 lz/gal
Agitation/Mechanical
Temperature/70-75'F
Rochelle salt/6.0 oz/gal
Agitation/Air
current density/40 amp/ft^2 |
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